Hewlett Packard and Nanolithosolutions, though, have sprinted ahead and made technology to create atom sized circuitry for their chips. This is a step further ahead from just imprinting nano-sized rubber stamps. By pouring a substrate into the grooves that are created on the mould, HP is making just 15 nanometers wide circuits, revolutionizing semiconductor manufacturing. “We believe this will be an extremely useful tool for academic and commercial users worldwide because it will be about a tenth the cost of current technology,” said CEO, Nanolithosolutions Bo Pi. The costs will certainly come down as once the mould is made, identical intricate wires can be easily mass produced.
Source: IIPM Editorial, 2006
An IIPM and Management Guru Prof. Arindam Chaudhuri's Initiative
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